Bulk metallic glass (BMG) is one of the predominant materials that are progressively used in the aerospace, medical devices, electronics, sporting goods and engineering materials. Examples include springs, miniature gears, high-end cell phones, slatted track covers, baseball clubs and computer shields. Making of components by BMG is still confrontation. Conventional methods of machining are restricted in use due to more tool wear and slower processing efficiency. Non-traditional methods of machining have been widely used for processing hard materials. Wire Electrical Discharge Machining (WEDM) is one among the promising approach of machining for hard and conductive materials, especially for the new BMG metal material. The preliminary aim of this exploration is to predict the temperature field distribution using the modified Gaussian heat source mode during WEDM multi-pulse discharge process. The impact of various variables like pulse off time and peak current over the pit depth and surface roughness is investigated. Taguchi's orthogonal arrays are espoused to analyze the influence of these parameters and to determine the better machining performance.