Plastic deformation mechanisms at high temperature
To further investigate the plastic deformation mechanism, typical temperatures of 1700°C and 1950°C for HPLT-B4C and LPHT-B4C respectively were selected in the study. The dependence of the diffusion-controlled deformation kinetics on temperature, stress and strain rate can be expressed as follows [35]:
$$\dot{\epsilon }=\frac{ADGb}{T}{\left(\frac{b}{d}\right)}^{p}{\left(\frac{\sigma }{G}\right)}^{n}{e}^{-\frac{Q}{RT}}$$
1
where \(\dot{\epsilon }\) is the strain rate; A is a constant; D is the diffusion coefficient; b is the Burgers vector; T is the temperature; d is the grain size; p is the grain size exponent; \(\sigma\) is the stress; G is the shear modulus; Q is the activation energy; R is the gas constant; n is the stress exponent and is used to identify the dominant mechanism.
Based on the constitutive equations, assuming that the temperature is constant, the relation between the stress \(\sigma\) and strain rate \(\dot{\epsilon }\) is simplified as [36]:
$${\sigma }=\text{B}{\dot{\epsilon }}^{\frac{1}{n}}$$
2
.
The activation energy Q was determined from the slope of the line shown in Figs. 4(c) and 4(f), which plot ln(σ−nT) at the same strain rate as a function of 1/T in the high-temperature deformation process.
The stress exponents n were calculated with the stress-strain curve obtained under various strain rates and a constant temperature. The activation energy Q was determined from the stress-strain curves obtained under different temperatures and a constant strain rate. The results showed that the plastic yield stress increased with the strain rate at a constant temperature.
HPLT-B4C and LPHT-B4C exhibited identical stress exponents (n = 2.1), suggesting that the plastic deformation of HPLT-B4C and LPHT-B4C was dominated by grain boundary sliding [33]. This is consistent with the observed intergranular fracture more in HPLT-B4C when significant plasticity occurred. The values of stress exponent in the present work (n = 2.1) were smaller than that from the available literature (n = 3), which was associated with deformation by dislocation motion [37]. The main reason was that the specimens in the current study possessed much smaller grain size, which favored grain boundary sliding with n = 2 rather than power law creep with n = 3. In addition, the heavy twinning introduced during processing of the HPLT-B4C would suppress dislocation motion [38]. Moreover, the present study mainly focused on the plastic deformation rather than creep conditions, with the strain rate of high-temperature deformation adopted here (within the range of 2×10− 4~8×10− 4 s− 1) being much higher than that in previous studies (10− 6 s− 1).
The values of Q for HPLT-B4C and LPHT-B4C were respectively 785 kJ/mol and 1126 kJ/mol, suggesting an acceleration of the dominant diffusion mechanism of HPLT-B4C relative to LPHT-B4C. Therefore, it indicated that the high-pressure and low-temperature sintering technology promoted grain boundary diffusion-controlled plasticity at a relative low temperature. The similar strengths and fracture modes of the two materials in the brittle fracture regime indicates that the grain boundaries were not significantly weakened by the HPLT treatment.
The activation energy values calculated from flexural deformation in the present study were higher than those in previous studies, which ranged from 385 kJ/mol to 632 kJ/mol [37, 39]. Effects of different sintering technologies, grain sizes measurement parameters and plastic deformation mechanism could be responsible for this increase in activation energy. As noted above, the dominant deformation mechanism, the strain-rate regime and the microstructures are significantly different in this work to the previous studies.
The above investigations revealed that the dominant mechanism of high-temperature plastic deformation was grain boundary sliding, rather than a direct effect of defects in nanoscale or larger scale.
In a pressure-assisted sintered B4C sample, both asymmetric and symmetric twins were detected (Fig. S5), consistent with the atomic ratio of B to C in the grain lattice (4:1) [40], while the observed non-stoichiometry resulted in a larger B:C ratio at grain boundaries. According to the previous study [22], when the atomic ratio of B to C increased above 4:1, the intrinsic hardness slightly decreased. Therefore, the hardness of HPLT-B4C along grain boundaries was correspondingly lower than that inside the grains. The yield stress of B4C ceramics at high temperatures was positively correlated with the hardness because there was no obvious grain deformation or texture during plastic deformation [25, 41]. Therefore, the grain boundary diffusion was promoted. As shown in Fig. 5, the plastic yielding of HPLT-B4C started at grain boundaries with slightly lower yield stress, leading to intergranular fractures. In contrast, for LPHT-B4C, the crack needed higher temperature to conquer the relative higher yield stress, which was identical between grain and boundary, and resulted in the mixture of transgranular and intergranular fractures. Ultimately, it was revealed that the unique crystals with boundary non-stoichiometry formed by high-pressure and low-temperature sintering technology greatly contributed to the improvement in plasticity at lower temperatures.
In summary, flexure experiments at high temperatures showed that B4C sintered under a high pressure had the better low-temperature plasticity. The plastic deformation temperature of the B4C ceramics sintered with high-pressure sintering technology was 200°C lower than that of B4C ceramics fabricated by conventional high-temperature sintering, with the plastic deformation mainly dominated by grain boundary sliding. Boundary non-stoichiometry in HPLT-B4C decreased the activation energy and thus favored lower-temperature plastic deformation. By regulating the state of the grain boundaries, the high-pressure sintering technology could stimulate the lower-temperature plasticity of ceramics while maintaining high strength before the plasticity occurred. The new technology proposed in the present study could enable non-oxide ceramics to meet the engineering application requirements in a broader range of temperatures.