The inductive component is the only missing components in thermal circuits unlike their electromagnetic counterparts. Herein, we report an electrically controllable reverse heat flow, which can be regarded as a proper equivalent of the “thermoinductive” effect. The underlying concept is the heating and cooling of the ends of the material by the Peltier effect under an applied ac current; this form a negative temperature gradient in the opposite direction in a controllable manner. We have derived the exact solution indicating that this reverse heat flow occurs universally in solid-state systems, even in conventional metallic Cu, and that it is considerably enhanced by thermoelectric properties (i.e., a large Seebeck coefficient and low thermal conductivity). A local cooling of 25 mK was demonstrated in (Bi,Sb)2Te3, which was explained by our exact solution. This electrically controlled reverse heat flow is directly applicable to the fabrication of a “thermoinductor” in thermal circuits.