Strategy to achieve low-dielectric-constant for benzoxazine-phthalonitriles: introduction of 2,2'-bis[4-(4-Maleimidephen-oxy)phenyl)]propane by in-situ polymerization

doi:10.21203/rs.3.rs-3839144/v1

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Strategy to achieve low-dielectric-constant for benzoxazine-phthalonitriles: introduction of 2,2'-bis[4-(4-Maleimidephen-oxy)phenyl)]propane by in-situ polymerization

https://doi.org/10.21203/rs.3.rs-3839144/v1

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published 09 May, 2024

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With the upgrading demand of high-frequency and high-speed communication field, it is imperative to develop low dielectric constant (Low-k) materials with higher temperature resistance. In the study, the thermosetting bi-functional benzoxazine-phthalonitrile bearing pendant allyl groups (Boz-ph) was modified with the 2,2'-bis[4-(4-Maleimidephen-oxy)phenyl)]propane (BMI-80). Specifically, the BMI-80 was reacted with the pendant allyl groups of Boz-ph by in-situ polymerization, and a series of high-performance Boz-ph/BMI-80 resins were synthesized. The effect of different proportions of Boz-ph/BMI-80 resins on the curing behavior, thermal stability, mechanical and dielectric properties was investigated. With the introduction of BMI-80, the microstructure of cured Boz-ph/BMI-80 resins was changed from brittle fracture to ductile fracture. Compared with pure Boz-ph (70.1 MPa), the flexural strength of Boz-ph/BMI-80-100% is up to their maximums of 102.8 MPa. Moreover, the Boz-ph/BMI-80 resins showed high glass transition temperature (T_g=325~333℃), low water absorption (less than 2.5%) and good dielectric properties. The dielectric properties improved with the increase of BMI-80 content, and the dielectric constant and dielectric loss of Boz-ph/BMI-80-100% were 3.51 and 0.008 (at 10 MHz). This work suggested that the Boz-ph/BMI-80 resins had great potential to be used as the matrix of the high-temperature and high-frequency copper-clad laminates.

Thermosetting

Benzoxazine-phthalonitrile

Cure behavior

Dielectric properties

High-temperature properties

Phthalonitrile thermosets are a class of high-performance thermosetting polymer consisting of three-dimensional networks, which have been widely used in in various fields (e.g., machinery manufacturing, electronic and electrical appliances, automotive, aerospace) due to their excellent dimensional stability, thermal and thermo-oxidative stability, superior chemical resistance, high char yield and good flame resistance [1–4]. However, numerous reports have confirmed that the traditional phthalonitrile resins have high dielectric constant and dielectric loss, high curing temperature and fragility due to their aromatic rigid structure, and the solubility is low in common organic solvents [5, 6]. These disadvantages limit the processing and further application of phthalonitrile resins in electronic materials field. With the rapid development of electronic information technology, functional polymer materials with superior performance and a variety of functions are urgently needed [7–9]. Therefore, in order to meet the needs of electronic information technology development, the traditional phthalonitrile resin is necessary to be modified through molecular design, to make it not only maintain the excellent heat-resistance and high mechanical strength, but also possess good dielectric properties, processability and diverse functions. Therefore, introducing special functional groups into the resin by molecular design is an effective way to achieve the modification of phthalonitrile.

In recent years, phthalonitrile containing benzoxazine (Boz-ph) is a novel phthalonitrile-based resin that was designed and synthesized, aiming for combining both the excellent properties of phthalonitrile (Ph) and benzoxazine (Boz) [10].The novel Boz-Ph resin not only exhibits the outstanding flame retardant and thermal properties derived from Ph resin, but also the autocatalytic reaction characteristics of Boz resin, which obviously made up for the shortcomings including difficult processing and high post-curing temperature of Ph-based resin. Xu et al. [11] have reported a novel self-cured allyl-functional phthalonitrile-containing benzoxazine (DBA-ph) monomer synthesized from diallylbisphenol A (DBA), paraformaldehyde (POM) and 3-Aminophenoxyphthalonitrile (3-APN). The DBA-ph resin showed lower post-curing temperature and higher thermal stability than previously reported Ph-based materials. However, the relatively high dielectric constant and dielectric loss of DBA-ph resin has restricted their applications as matrix in high-speed and high-frequency communication. Therefore, it is very essential and urgent to develop high-performance thermosets with excellent comprehensive properties (especially low dielectric constant and dielectric loss).

In order to overcome these challenges, the advanced material, such as bismaleimide (BMI), is regarded as one of the preferred high-performance resin [12]. In this work, the Boz-ph/BMI-80 resins derive from bi-functional benzoxazine-phthalonitrile bearing pendant allyl groups (Boz-ph) and 2,2'-bis[4-(4-Maleimidephen-oxy)phenyl)]propane (BMI-80) were prepared by in-situ polymerization. The replacement of long chain structure and ether groups in BMI-80 resin can reduce the dielectric constant of the Boz-ph/BMI-80 resins and increase its toughness. Besides, the pendant allyl groups in Boz-ph could react with BMI-80 to form a prepolymer, which solved the drawbacks of easy crystallization of BMI-80 resin in the process of impregnating fiber cloth. Therefore, the curing behaviors of the Boz-ph/BMI-80 resins and the effect of cross-linking on the morphological, mechanical, thermal and dielectric properties were systematically evaluated.

2.1 Materials

2,2'-bis[4-(4-Maleimidephen-oxy)phenyl)]propane (BMI-80, appearance: light yellow powder, purity: ≥99%, T_m=165℃) and Boz-ph prepolymers (appearance: yellow powder) were synthesized according to the similar preparation procedure in the previous literatures [13, 11]. 3-Aminophenoxyphthalonitrile (3-APN, T_m=174℃) was provided from Dymatic Special Chemicals Co. Ltd (Chengdu, China). Diallylbisphenol A (DBA) was purchased from Honghu City Shuangma New Material Technology Co. LTD (Honghu, China). Paraformaldehyde (POM), Xylene and N,N-Dimethylformamide (DMF) were purchased from Chengdu Kelong Chemicals Co. Ltd (China). All the reagents were used without further purification. Moreover, the chemical structure of Boz-ph and BMI-80 monomers are shown in the Fig. 1.

2.2 Preparation of the Boz-ph/BMI-80 prepolymers

The typical synthesis process of Boz-ph/BMI-80 prepolymers is as follows. Firstly, a certain weight of 3-APN, DBA and POM (the molar ratios are fixed at 2:1:4, respectively) were dispersed into the DMF and Xylene, and the mixed solution was stirred at 60 ℃ for 8 h. Then, a certain weight of BMI-80 monomer was added into above solution and the reaction was carried out in 140 ℃ for another 2 h (Until the xylene is removed). Subsequently, the Boz-ph/BMI-80 prepolymers were cooled to room temperature, then it was ground fine and washed multiple times with NaOH solution (3 mol/L), deionized water and ethanol to remove the residual monomer. Finally, the Boz-ph/BMI-80 prepolymers were placed in a vacuum oven at 80 ℃ for 24 h. The synthetic route of Boz-ph/BMI-80 prepolymers is shown in Fig. 1.

2.3 Preparation of the Boz-ph/BMI-80 resins

Cured BMI-80, Boz-ph and Boz-ph/BMI-80 resins were prepared using casting forming and high temperature curing method. Meanwhile, the curing temperature program of all samples was carried out with the procedure of 200 ℃, 220 ℃, 240 ℃, 260 ℃ and 280 ℃ for 2 h each, respectively. After being cooled to room temperature, black Boz-ph/BMI-80 resins were obtained. Specifically, the molar ratios of Boz-ph to BMI-80 were designed as 4:1 (Boz-ph/BMI-80-25%), 2:1 (Boz-ph/BMI-80-50%) and 1:1 (Boz-ph/BMI-80-100%), respectively.

2.4 Characterizations

Differential scanning calorimetry (DSC, TA-Q100) was performed to study the curing behavior of Boz-ph/BMI-80 prepolymers under N₂ atmosphere at a heating rate of 10 ℃/min from 30 ℃ to 350 ℃. Utilizing Perkin-Elmer Spectrum (NICOLET 6700, USA) measurements with an Attenuated Total Reflectance system (ATR) from 450 cm^− 1 to 4000 cm^− 1, the FT-IR of pure BMI-80, Boz-ph prepolymer and Boz-ph/BMI-80 resins were assessed. Thermal gravimetric analysis (TGA, TA-Q50) was used to evaluate the thermal properties of Boz-ph/BMI-80 resins under N₂ atmosphere at a heating rate of 20 ℃/min from 30 ℃ to 800 ℃. Dynamic mechanical analysis (DMA) was performed on Q800 dynamic mechanical analyzer to determine the T_g of Boz-ph/BMI-80 resins by three-point bending mode (the sample size is length:ཞ40 mm; width:ཞ8 mm; thickness:ཞ5 mm). Scanning electron microscopy (SEM, JEOL) of cured Boz-ph and Boz-ph/BMI-80 resins was performed on JSM-T300 at 20 kV after gold coating treatment. Mechanical properties of all samples (the sample size is length:ཞ80 mm; width:ཞ10 mm; thickness:ཞ4 mm) were carried out by a SANS CMT6104 Series Desktop Electromechanical Universal Testing Machine (Shenzhen Sans Materials Testing Machine Co., Shenzhen, China) under bending mode with a crosshead speed of 1 mm/min. The water absorption was tested in boiled water bath (temperature: 100 ℃, sample size: 100 mm×10 mm×4 mm) for 72 h. Before the test, the mass of the sample after drying at 80 ℃ for 12 h is denoted as W₁, the sample was then immersed in boiling water for a certain amount of time, and the mass of sample after taking out the sample and drying the surface water is denoted as W₂, then the water absorption rate can be calculated by formula (1):

$$\mathbf{W}\mathbf{a}\mathbf{t}\mathbf{e}\mathbf{r} \mathbf{a}\mathbf{b}\mathbf{s}\mathbf{o}\mathbf{r}\mathbf{p}\mathbf{t}\mathbf{i}\mathbf{o}\mathbf{n} \left(\mathbf{\%}\right)=\left(\frac{{\varvec{W}}_{2}-{\varvec{W}}_{1}}{{\varvec{W}}_{1}}\right) \left(1\right)$$

3.1 Characterization of Boz-ph/BMI-80 prepolymers

In order to evaluate the molecular weight and gel time of Boz-ph and Boz-ph/BMI-80 prepolymers, the Boz-ph/BMI-80-100% prepolymers were confirmed by GPC and gel time tester, as given in Fig. 2. As can be seen from Fig. 2a, the weight average molecular weight (M_w) and number average molecular weight (M_n) of Boz-ph/BMI-80-100% prepolymers were 33769 g/mol and 6368 g/mol, respectively. The results indicated that the BMI-80 resin was reacted with the pendant allyl groups of Boz-ph by in-situ polymerization to form the Boz-ph/BMI-80 prepolymers. The gel time of Boz-ph and Boz-ph/BMI-80-100% prepolymers was tested and shown in Fig. 2b. It can be seen that the gel time of Boz-ph prepolymers at 190°C is about 795 s, while the gel time of Boz-ph/BMI-80-100% prepolymers is increased to 1520 s, which is mainly attributed to the introduction of BMI-80 units with low chemical reactivity. Obviously, the gel time of Boz-ph and Boz-ph/BMI-80-100% prepolymers decreased with the further increase of temperature. When the temperature reached 230 ℃, the gel time of Boz-ph and Boz-ph/BMI-80-100% prepolymers decreased 218 s and 280 s, respectively. Compared with pure BMI-80 resin, the gel time of Boz-ph/BMI-80-100% prepolymers was significantly shortened, which is the key parameter during the processing of the resin matrix.

3.2 Curing behavior of Boz-ph/BMI-80 prepolymers

Figure 3a shows the digital images of Boz-ph/BMI-80 prepolymers with 70 wt% (top) and 30wt% (bottom) solid content in DMF solution, respectively. When the solid content is more than 50%, the Boz-ph/BMI-80 system presents a reddish-brown transparent viscous liquid, and there is no precipitation or phase separation during three months of storage. Then, DSC curves were used to study curing behavior of pure BMI-80, Boz-ph and Boz-ph/BMI-80 prepolymers, as shown in Fig. 3b. There are an obvious endothermic peak around 165 ℃ and an exothermic peak near 295 ℃, which belong to the melting peak and curing peak of pure BMI-80. However, the melting point peak of BMI-80 resin did not appear in the DSC curves of Boz-ph/BMI-80 prepolymers, indicating that BMI-80 was involved in the prepolymerization of Boz-ph. Moreover, Boz-ph/BMI-80 prepolymers exhibited two curing peaks, the first peak corresponds to its oxazine ring-opening reaction while the second peak is mainly the exothermic peak of polymerization of phthalonitrile groups and double bonds in the presence of phenol [14]. With the increase of BMI-80 content, the two curing peaks of Boz-ph/BMI-80 prepolymers gradually moved to the high temperature zone, indicating that the introduction of BMI-80 reduces the reactivity of the cross-linking groups. In summary, the Boz-ph/BMI-80 prepolymers exhibited lower curing temperature in comparison with pure BMI-80 resin.

3.3 FTIR characteristics of Boz-ph/BMI-80 resins

The chemical structure of pure BMI-80, Boz-ph prepolymer and Boz-ph/BMI-80 resins were confirmed by FTIR as shown in Fig. 4. As you can see from Fig. 4a, the characteristic absorption peak at 2230 cm^− 1 corresponds to the symmetrical stretching vibration of –CN groups [15, 16]. The peaks at 1712 cm^− 1 and 1580 cm^-1 are assigned to the stretching vibration absorption peak of the carbonyl groups (-C = O) on the imide ring and skeleton vibration peak of benzene rings, respectively. The band at 1245 cm^− 1 is the reflection of stretching vibrations of aromatic C–O–C groups, and the bands at 1327 cm^-1, 1229 cm^-1 corresponding to the vibration peaks of methylene groups and antisymmetric stretching vibration peaks of ether bonds connected with the oxazine rings [17]. The peak at 1158 cm^-1 corresponded to the asymmetric contraction vibration peak of C-N-C, and the bands at 947 cm^-1and 996 cm^-1corresponding to the characteristic absorption peak of oxazine ring and the in-plane bending vibration peak of -C-H on allyl group, which are consistent with previous literature reports [18]. Besides, the characteristic peak at 692 cm^-1 is attributed to the = C-H in the maleimide groups [11]. After high-temperature curing in Fig. 4b, the peaks at 947 cm^-1, 1229 cm^-1 disappeared, indicating that the oxazine ring of benzoxazine had been opened and solidified [19]. Meanwhile, the triazine absorption peaks at 1360 cm^− 1 were observed as the result of the curing of nitrile (-CN) groups. Moreover, the depressed absorption peaks of = C-H proved the copolymerization of BMI-80 and Boz-ph resins.

In this work, the Boz-ph was selected as the based matrices to modify BMI-80 resin, which is expected to obtain a kind of thermosets with excellent comprehensive properties. The ring-opening polymerization of benzoxazine rings (seen from Fig. 5a) and ring-forming polymerization of nitrile groups (seen from Fig. 5b) will be very beneficial to improve its thermal stability, mechanical and dielectric properties.

3.4 Morphology of cured Boz-ph/BMI-80 resins

The morphologies of cured Boz-ph and Boz-ph/BMI-80 resins are evaluated by SEM images, as given in Fig. 6. In Fig. 6a and Fig. 6b, cured Boz-ph resin shows a good homogeneous phase structure, indicating that the resin was fractured by rapid crack growth without obvious macroscopic deformation. When the molar ratios of Boz-ph to BMI-80 was designed as 4:1, the Boz-ph/BMI-80-25% resins is still dominated by Boz-ph, and the polymer chain segment formed by the self-polymerization shows brittle fracture (seen from Fig. 6c and Fig. 6d). With the further addition of BMI-80 content, a continuous wavy-like phase structure indicates composite starts to be formed (seen from Fig. 6e-6i), with a shadowy outline of matrix and toughening phase. That is to say, the introduction of BMI-80 units changed the cross-linking structure of the Boz-ph/BMI-80 resins. Whether the pendant allyl groups of Boz-ph were reacted with the double bond of BMI, or the Boz-ph after ring-opening was inserted into the triazine ring to form cyanuric acid ester, and then isomerized to form a more complex interpenetrating network structure (IPN), it can significantly improve the toughness of Boz-ph/BMI-80 resins. Thus, it is can predicted that the Boz-ph/BMI-80 resins will present excellent mechanical properties.

3.5 Mechanical properties of cured Boz-ph/BMI-80 resins

It is well-known that the structure formation of the cross-linking network played a key role in in the comprehensive properties of resins system. Cured Boz-ph/BMI-80 system shows a characteristically black and rigid form, and the mechanical properties are shown in Fig. 7a-b and Table 1. Obviously, the typical stress-strain curve of cured Boz-ph resin suggests a brittle fracture characteristic and similar to the thermosetting-based resins, which is consistent with SEM image in Fig. 6. With the increase of BMI-80 content, the slope of stress-strain curves has decreased slightly, indicating that the rigidity of the Boz-ph/BMI-80 system is weakened. In particular, the flexural strength of Boz-ph/BMI-80 resins significantly increased, it reaches the maximum in Boz-ph/BMI-80-100%. Compared with pure Boz-ph resin (70.1 MPa), the flexural strength of the Boz-ph/BMI-80-100% resins increased by 46.6%. However, the flexural modulus of Boz-ph/BMI-80 resins showed the opposite trend, decreasing first rapidly and then slowly, which can be attributed to two reasons as follows. On the one hand, the allyl groups of Boz-ph react with the C = C of BMI-80 may disrupt the chain packing, increase the free volume, and then lower the cross-linking density; on the other hand, the long chain structure and ether linkage (-O-) of BMI-80 had a positive effect on the toughness of interpenetrating polymer networks (IPN) system [20,21].

Table 1

Mechanical properties of cured BMI-80, Boz-ph and Boz-ph/BMI-80 resins
Samples	Flexural Strength/MPa	Flexural modulus/MPa
Cured Boz-ph	70.1	3070
Boz-ph/BMI-80-25%	74.8	2820
Boz-ph/BMI-80-50%	84.6	2540
Boz-ph/BMI-80-100%	96	2450
Cured BMI-80	102.8	2400

3.6 Thermal properties of the cured Boz-ph/BMI-80 resins

TGA and DTG analysis were used to evaluate the thermal properties of the cured BMI-80, Boz-ph and Boz-ph/BMI-80 resins as shown in Fig. 8 and Table 2. It can be seen from Fig. 8a and Table 2, the cured Boz-ph resin shows good thermal properties, and the T_5% (5% weight loss temperature) is up to 385 ℃. Obviously, the introduction of BMI-80 into Boz-ph made Boz-ph/BMI-80 resins shift to a higher temperature. The T_5% of Boz-ph/BMI-80-25%, Boz-ph/BMI-80-50% and Boz-ph/BMI-80-100% resins are 387 ℃, 401 ℃ and 402 ℃, respectively, which is due to the highly heat-resistant aromatic heterocyclic cured structure of BMI-80 resin (T_5% is up to 477 ℃). Besides, the T_max (maximum decomposition temperature) was obtained from the peaks of the DTG curves. As shown in Figs. 8b and Table 2, the T_max of Boz-ph/BMI-80 resins is in the range of 420–468 ℃, which is much higher than that of pure Boz-ph resin (T_max is only 405 ℃). These results confirmed that BMI-80 could obviously improve the thermal properties of Boz-ph resin.

Table 2

Thermal performance of cured BMI-80, Boz-ph and Boz-ph/BMI-80 resins
Samples	T_5%/℃	T_max/℃	C_y800/%
Cured Boz-ph	385	405	69.2
Boz-ph/BMI-80-25%	387	420	66.7
Boz-ph/BMI-80-50%	401	437	66.2
Boz-ph/BMI-80-100%	402	468	60.8
Cured BMI-80	477	491	41.9

3.7 DMA curves of the cured Boz-ph/BMI-80 resins

Figure 9 shows the relationship curves of the energy storage modulus (E'), loss tangent (tan δ) and temperature of cured BMI-80, Boz-ph and Boz-ph/BMI-80 resins. As can be seen from Fig. 9a and Table 3, when the temperature is 50 ℃, the E' of cured samples of each formula is above 1.6 GPa. With the increase of temperature, the E' of all cured samples gradually decreases due to the gradual relaxation of copolymer network, and the E' drops sharply when the temperature is about 300 ℃. In the cured Boz-ph/BMI-80 resins, it can be clearly seen that the E' of cured Boz-ph/BMI-80-25% is the highest at low temperature. With the addition of BMI-80, the E' of Boz-ph/BMI-80 resins gradually decreases, it reaches the minimum in Boz-ph/BMI-80-100%. This is mainly because cured Boz-ph has higher rigidity than cured BMI-80, and the increase of Boz-ph content will inevitably lead to the increase of rigidity and modulus of Boz-ph/BMI-80 resins. Figure 9b displays the glass transition temperature (T_g, top temperature of tan δ peak) of all samples. Obviously, the T_g of Boz-ph/BMI-80 resins is between 325–333 ℃, which is far more superior T_g than diallylbisphenolA (DBA) modified bismaleimide-triazine (BT) system (T_g=228ཞ316 ℃) [22].

Table 3

Storage modulus and glass-transition temperature (T_g) of cured BMI-80, Boz-ph and Boz-ph/BMI-80 resins
Samples	Initial Storage modulus at 50 ℃ (MPa)	T_g
Cured Boz-ph	3619	321
Boz-ph/BMI-80-25%	2462	325
Boz-ph/BMI-80-50%	2963	329
Boz-ph/BMI-80-100%	3123	333
Cured BMI-80	1629	343

3.8 Dielectric properties and water absorption of cured Boz-ph/BMI-80 resins

The introduction of BMI-80 resin was expected to decrease the dielectric constant and dielectric loss of Boz-ph/BMI-80 resins. The dielectric properties with a function of frequency for cured BMI-80, Boz-ph and Boz-ph/BMI-80 resins were presented in Fig. 10. From Fig. 10a, the dielectric constants (ε) of all samples showed a slightly decrease with frequency in the low frequency region. However, it can be clearly seen that all samples exhibited relatively stable dielectric constants at high frequencies, which will be very potential applications in high-frequency communications. In the Boz-ph/BMI-80 resins, the ε of the cured Boz-ph/BMI-80 decreased gradually with the increase of BMI-80 loading, from 4.16 to 3.51 (at 10 MHz). In addition, the cured Boz-ph/BMI-80 resins exhibited low and relatively stable dielectric loss, and the dielectric loss (tan δ) of Boz-ph/BMI-80-100% was as low as 0.008 (see from Fig. 10b). Besides, the corresponding dielectric constants and dielectric loss of Boz-ph/BMI-80 resins reduce, accompanying the increase of BMI-80 loading, owning to two factors: (1) the molecular structure of Boz-ph contains a large number of polar groups such as allyl and nitrile groups, and the molecular polarity is difficult to offset, resulting in high dielectric constant and dielectric loss; (2) the molecular structure of BMI-80 is symmetrical, the polarity cancels each other out, and the dipole loss is small over a wide temperature range, so it has excellent dielectric properties [23–25].

Furthermore, the water absorption of cured BMI-80, Boz-ph and Boz-ph/BMI-80 resins were tested in boiled water for 12 h, and the results are presented in Fig. 11. It can be seen that the water absorption of cured BMI-80 is as low as 2.1%. The water absorption of Boz-ph/BMI decreased with increasing BMI-80 (less than 2.5%), indicating that the introduction of the alkyl structure (-CH₃) increased the hydrophobic nature of Boz-ph/BMI-80.

In summary, novel Boz-ph/BMI-80 resins were prepared by using of pre-polymerization and casting forming method. The curing behaviors and micro-morphologies of Boz-ph/BMI-80 resins were investigated in detail by FTIR, DSC and SEM, respectively. By utilizing Boz-ph as matrix and BMI-80 as modifiers, novel homogeneous prepolymer glue with adjustable viscosity was obtained, which is beneficial to regulate the mechanical and dielectric properties of Boz-ph resin. Compared with Boz-ph resin (70.1 MPa), the Boz-ph/BMI-80-100% resins showed good mechanical properties, with a maximal flexural strength (102.8MPa). Moreover, the Boz-ph/BMI-80 resins exhibited high the glass transition temperature (T_g=325 ~ 333℃) and initial decomposition temperature (T_5%=387–402℃). More importantly, the Boz-ph/BMI-80 resins showed good dielectric properties and excellent dielectric stability over a wide range of frequencies.

Conflicts of interests

The author(s) declared no potential conflicts of interest with respect to the research, authorship, and/or publication of this article.

Acknowledgment

The authors wish to thank the National Natural Science Foundation of China for their financial support (Project No. 51773028 and 52073039).

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Strategy to achieve low-dielectric-constant for benzoxazine-phthalonitriles: introduction of 2,2'-bis[4-(4-Maleimidephen-oxy)phenyl)]propane by in-situ polymerization

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Abstract

Figures

1. Introduction

2. Experimental

2.1 Materials

2.2 Preparation of the Boz-ph/BMI-80 prepolymers

2.3 Preparation of the Boz-ph/BMI-80 resins

2.4 Characterizations

3. Results and discussion

3.1 Characterization of Boz-ph/BMI-80 prepolymers

3.2 Curing behavior of Boz-ph/BMI-80 prepolymers

3.3 FTIR characteristics of Boz-ph/BMI-80 resins

3.4 Morphology of cured Boz-ph/BMI-80 resins

3.5 Mechanical properties of cured Boz-ph/BMI-80 resins

3.6 Thermal properties of the cured Boz-ph/BMI-80 resins

3.7 DMA curves of the cured Boz-ph/BMI-80 resins

3.8 Dielectric properties and water absorption of cured Boz-ph/BMI-80 resins

4. Conclusion

Declarations

Conflicts of interests

Acknowledgment

References

Status:

Journal Publication

Version 1