Materials
Formamidinium iodide (FAI, 99.5%, GreatCell), Lead (II) iodide (PbI2, 99.99%, TCI), lead chloride (PbCl2, 98%, Aladdin), N,N-dimethyl formamide (DMF, 99.8%, Acros), dimethyl sulfoxide (DMSO, 99.7%, Acros), titanium diisopropoxide bis(acetylacetonate) (75 wt% in isopropanol, Aladdin), TiO2 paste (NR30, GreatCell), decylamine (DA, 98%, Sigama-Aldrich), sulfuric acid (H2SO4, 98%, Sinopharm). Cesium iodide (CsI), Methylamine iodine (MAI), methylamine hydrobromide (MABr) were purchased from Xi'an Polymer Light Technology Corp. ZrO2 paste, carbon paste, and FTO glasses were supplied by Hubei WonderSolar Co., Ltd. Unless otherwise specified, all the materials were directly used without any purification.
Precursor preparation
The CsFAMA-based perovskite solution was prepared by dissolving 0.013 g CsI, 0.0045 g MABr, 0.0112 g PbCl2, 0.0318 g MAI, 0.1376 g FAI, 0.461g PbI2 in a mixed solvent (640 ul DMF with 160 ul DMSO) and stirring at 50°C for 1 h. The chemical formula can be described as Cs0.05FA0.8MA0.15PbI0.96Br0.04 (with excess 5% MACl). Besides, the DA2SO4 solution was prepared by pipetting certain amount of DA and H2SO4 in a mixed solvent (chlorobenzene: isopropanol = 5:1) for 10 mM concentration.
Device Fabrication
First, the FTO glasses were etched with femtosecond laser for constructing circuit patterns. Next, the FTO glasses were ultrasonically cleaned with detergent, deionized water, and anhydrous ethanol, each solvent for 10 mins, respectively. Then, a compact TiO2 layer was deposited onto the FTO glass by spraying pyrolysis with titanium isopropoxide bis(acetylacetonate) precursor (mass ration = 1:8) at 450 ℃. The triple-layer mesoporous scaffold was deposited onto the compact TiO2 layer by screen-printing mp-TiO2 paste, mp-ZrO2 paste and carbon paste one by one, in which mp-TiO2 layer was sintered at 500°C for 40 mins, mp-ZrO2 and carbon layers were sintered together at 400°C for 40 mins. After cooling down, the perovskite precursor was drop onto the carbon for infiltrating the mesoporous scaffold, and then it was annealed at 56°C in a chamber for 18 h. All the processes were conducted in humid room temperature air (25 ℃, 70% RH).
Treatment process
The fabricated device was first immersed with DA2SO4 solution in a culture dish, and then heated at 50 ℃ for a certain period of time (1, 2, 4, 8, 15, 30 mins). After that, the device was taken out and washed by chlorobenzene to remove unreacted DA2SO4. Last, it was annealed at 70 ℃ for 20 mins. The process was conducted in humid room temperature air (25 ℃, 70% RH).
Characterization
A Nova NanoSEM 450 type field emission scanning electron microscope was employed to obtain SEM images. An X’pert PRO type X-ray diffractometer was employed to obtain XRD patterns, using Cu Kα radiation under the condition of 40 mA and 40 kV, with a scanning range from 4° to 40° and a scanning speed of 8°/min. A VERTEX70 type infrared Fourier transform microscope was employed to obtain FTIR spectra. An Axis-Ultra DLD-600 W type X-ray photoelectron spectrometer was employed to obtain XPS spectra. A SolidSpec-3700 Shimadzu UV–vis–NIR type spectrophotometer was employed to obtain UV-vis spectra. An ultraviolet photoelectron spectrometer based on a Kratos Axis Ultra DLD system using He I excitation source (hν = 21.22 eV) was employed to obtain UPS spectra. A LabRAM HR800 type Raman microscope with a 532 nm excitation laser was employed to obtain steady-state PL spectra. A HORIBA Scientific DeltaPro type fluorimeter was employed to obtain TRPL result. A Newport 91192 type solar simulator was employed to generate a simulated AM 1.5G illumination of 100 mW·cm− 2, and with a Keithley 2400 type digital source/meter, the J–V curves can be obtained by reverse scanning from 1.1 to − 0.1 V with a scanning rate of -20 mV·s− 1. The light intensity depended VOC plot was obtained by conducting J-V tests under 1, 0.8, 0.5, 0.3, and 0.1 of the light intensity of the AM 1.5G illumination, achieved by the filters. The active area of the device was estimated to be 0.8 cm2, and a mask with a 0.1 cm2 circular aperture was employed for all the J-V tests. Besides, the dark J-V curves of SCLC were obtained by scanning from 0 to 2 V with a scanning rate of 10 mV·s− 1. A 150 W Oriel xenon lamp fitted with a Cornerstone 74004 type monochromator was employed as a monochromatic source for obtaining external quantum efficiency. A ZAHNER Zennium type electrochemical workstation was employed to obtain EIS spectra, Mott-Schottky plot, and TPV plot. For the EIS, a frequency ranging from 1 MHz to 100 mHz was adopted, with a bias of -0.6 V under dark condition, and for the Mott-Schottky measurement, a voltage range from − 0.2 V to 1.2 V was adopted, with a frequency of 20 kHz and a step of 10 mV.
Sample preparation
For the XRD sample, the p-MPSC devices were first fabricated, and then the DA2SO4 treatment was conducted (or not) on them, as the methods mentioned above. Last, the carbon layer of the device was mechanically removed with adhesive tape for reducing the diffraction intensity of carbon. For the XPS, UPS, UV-vis, FTIR samples, the perovskite precursor solution was first prepared as the above description. And then, a consecutive two-step spin coating method was adopted for fabricating the perovskite film. Specifically, 30 ul perovskite solution was first pipetted onto an ultraviolet/ozone treated substrate (1.5 cm×1.5 cm), then spun at 1000 rpm for 10 s and 6000 rpm for 30 s with the accelerations of 200 and 2000 rpm, respectively. During the second step, 60 µL anti-solvent chlorobenzene was dropped onto the spinning film. Last, the film was annealed at 100°C for 20 mins. For the DA2SO4 treated perovskite film, DA2SO4 solution was first pipetted onto the fabricated perovskite film to react for 30 s, and then the two-step spinning process was repeated without using chlorobenzene. Last, the film was annealed at 70°C for 10 mins. The processes were conducted in a N2 glovebox at room temperature. For the PL sample, mp-ZrO2/Carbon mesoscopic scaffold was first deposited onto the glass, and then the perovskite was deposited in it, next the DA2SO4 treatment was conducted (or not) on that, as the methods mentioned above. Last, the carbon layer of the device was mechanically removed with adhesive tape and polished with sandpaper.