High-Power Light Emitting Diodes (HPLEDs) are a leading example of modern lighting technology and are praised for being more efficient than traditional light source’s. This study explores the complex relationship between HPLED service life, junction temperature (Tj), and heat dissipation through drop-shaped pin fins type heat sink attached to HPLED. Four different power inputs 50, 100, 150, and 200W were analysed using three different vertical pin fin spacings (Sv = 25, 50, and 75 mm). A data acquisition system was created to measure temperature, current, LED light intensity (Lux), and voltage values using sensors. These values were then used as the best possible reference values for a well-known Arrhenius equation model to predict the lifetime of the device. The results shows, as power input levels rise, Tj also increases, which reduces the life of HPLEDs. There is a distinct inverse relationship between device lifetime and Tj that exhibits a nonlinear exponential decay pattern. For 200 and 50 W power input, respectively, the maximum junction temperature of the HPLED attaching drop-shaped pin fin heat sink was found to be 134.78°C and the minimum Tj was found to be 60.13°C. The drop-shaped fin pin heat sink with a 75 mm fin spacing was found to have a maximum heat transfer coefficient of 9.81 W/m2K. With a 200 W power dissipation and a junction temperature (Tj) of 134.78°C, the HPLED had a short expected operational life of 1780.2 hours. On the other hand, a projected lifetime of 3996.30 hours is anticipated at a higher temperature of Tj=112.18°C.