mETF for simple and versatile 3D structuring
Representative benefits of 3D MEA are illustrated in Fig. 1a. The protruding structures enable closer proximity to target cells, establishing more localized neural interfaces for both neural recording and stimulation27–30. This is in contrast to conventional planar MEAs, in which the electrode surfaces inherently lie below the top surface31–33. As outlined in Fig. 1b, the proposed one-step mETF process locally deforms a planar MEA into a 3D MEA with microscopic protruding and/or recessed structures. A planar 25-channel LCP MEA prepared via a conventional microfabrication process32 (see Supplementary Fig. S1) is thermally pressed (> Tg) against a 3D-printed mold within a set of metal jigs and elastomer layers for alignment (see Supplementary Fig. S2–3 for details), replicating the protruding and/or recessed 3D microstructures of the mold to the MEA, as shown in Fig. 1c.
Additionally, the microelectrothermoformed 3D MEA can be grossly deformed into nonplanar shapes to conform to surrounding tissues, such as eye curvature for retinal electrodes, through a similar “macro” electrothermoforming step (mETF, see Supplementary Fig. S4). Using a 3D mold with 80 mm-height pillars (Supplementary Fig. S5), the schematics (top row) and photographs (bottom row) in Fig. 1d show the evolution of a (i) 40-mm-thick planar LCP MEA to a (ii) protruding or (iii) recessed mETF MEA, and subsequently to a (iii) mETF + mETF MEA, achieving both high proximity to target cells and conformability to target tissues. The recessed structures in (iii) can be easily generated using the identical processes and tools to those for the protrusions, simply by flipping the planar array upside down in the fixture, offering a convenient approach to create well-like structures for highly localized electrode–cell environments29. Scanning electron microscopy (SEM) images of individual electrode sites before and after mETF are presented in Fig. 1e, with their cross-sectional profiles shown in Fig. 1f. Each channel site with a diameter of 200 mm was selectively elevated or lowered by a height of 80 mm, which represents an optimized height for subretinal electrode arrays as a proof-of-concept application of mETF (details in subsequent sections). The optical surface profiles of the protruding (top) and recessed (bottom) channel sites are shown in Fig. 1g. The mETF produced 3D structures that replicated the original mold structures, exhibiting a slightly widened base diameter (~150%) and sloped sidewalls (~70°). The electrode diameter as small as 100 mm was also successfully thermoformed using the same mETF configuration (Supplementary Fig. S6), which was utilized for following ex vivo experiments.
Similarly, versatile protruding and recessed structures of diverse heights and shapes can be created without adding fabrication complexities. Figure 2a–f present 25-channel LCP MEAs formed with varying protrusion/recessed heights from 80 to 200 mm using a 3D mold (Supplementary Fig. S7). Their SEM images (Fig. 2a, b), cross-sectional images (Fig. 2c, d), and optical 3D profiles (Fig. 2e, f) confirm the faithful replication of the 3D mold structures onto the LCP MEAs. Furthermore, the versatility of the microthermoforming process was demonstrated with various microstructures, including polygons (triangles, rectangles, and hexagrams), ovals (sunken, plateau, and walled), domes, and S-shaped walls, as shown in Fig. 2g and h; their SEM images and optical profiles are shown in Fig. 2i and j, respectively. All distinct structures were created via one-step mETF using corresponding 3D molds shown in Supplementary Fig. S7. Such versatility and consequent design flexibility can be leveraged to create optimized 3D structures tailored for various in vivo and ex vivo neural interfacing applications.
Electromechanical considerations for mETF
Despite the simplicity and versatility of the mETF process, it is important to consider the tensile stress exerted on the thin gold layers, which may lead to cracks or disconnections. Therefore, the mETF process was optimized with respect to the 3D mold design and pattern layout.
Fig. 3a presents a finite element analysis (FEA) of the mechanical stress induced within the embedded thin gold layer during an 80-mm-height mETF. Based on the relative stress distribution for the top, bottom, and neutral planes within a gold layer (Fig. 3b), the highest tensile stresses are expected at the top and bottom corners of the sidewall (insets in Fig. 3a). On the other hand, the top protruding area remained relatively stress-free because of the pillar-shaped mold with a flat top surface. The resulting plateau-like structure of the mETF electrode ensured minimal damage to the circular electrode area, which were designed to be 10 mm smaller than the mold top diameter, as outlined on the transversal stress distribution in Fig. 3c. This is in contrast to forming a 3D structure using a dome-shaped mold, in which electrode sites are subjected to highest tensile stress, leading to significant cracks on the gold electrode surface after mETF (Supplementary Fig. S8).
The mechanical strength of microelectronic tracks was enhanced by electroplating the gold patterns up to 4 mm thickness (t). Additionally, the interconnection lines traversing the region under the greatest stress is configured with serpentine shapes for enhanced robustness against elongation, as shown in Fig. 3c and inset (r = 20 mm, d = 40 mm, and q = 180˚). Typical serpentines adopted in stretchable electronics exploit global out-of-plane buckling of thin gold tracks embedded within freestanding polymer layers34,35. However, the gold serpentine layer in mETF is subject to in-plane constraint as they are pressed between jig and mold. Therefore, the stretchability of such in-plane serpentine gold interconnections was evaluated in comparison with the conventional out-of-plane wavy lines via FEA simulation under the maximum local elongation during 80 mm-height mETF (ε = 15%, red area in Fig. 3c). As shown in Fig. 3d and e, both in-plane and out-of-plane serpentines exhibited reduced maximum stress with lower w and greater q (more details in Supplementary Fig. S9). Although in-plane restriction resulted in 33% higher peak stress than out-of-plane buckling serpentines with w = 10 mm, the wavy patterns are still effective in relieving the tensile stress of gold lines during mETF, by reducing the peak stress by 90% from the straight line.
These design considerations were experimentally validated using patterns with varying shapes (straight and wavy) and thicknesses (t = 300 nm to 4 mm) in 80-mm-height mETF. The representative SEM images in Fig. 3f demonstrate that damages to the gold layers were caused by two distinct mechanisms, as quantified by yield analysis after mETF in Fig. 3g. The “electrode cracks” occurred mostly in the thin gold patterns (t = 300 nm and 2 mm) with relatively lower mechanical strength, resulting in a distributed crack-formation throughout the circular electrode sites. On the other hand, circular electrodes with higher gold thickness (4 mm) remained intact, while focused mechanical stress caused a single spot of line disconnection, which corresponds to the location of the highest stress estimated in Fig. 3c and d. The wavy shapes with w = 10 mm and t = 4 mm (III) was adopted as the optimized parameters throughout this study for the 80 mm-height-mETF, because they secured 100% tolerance (Fig. 3g). Thicker patterns than 4 mm did not provide mechanical enhancement (Supplementary Fig. S10).
Electrochemical and mechanical analysis of mETF MEA
The intactness of the neural interfaces during mETF was confirmed via electrochemical analyses, including electrochemical impedance spectroscopy (EIS) and cyclic voltammetry (CV) of MEAs before and after mETF. Additionally, iridium oxide (IrOx) layer was electrodeposited on top of the gold channels before and after deformation to demonstrate the compatibility of mETF process with nanoporous surface functionalization techniques widely used for enhancing the charge transfer capabilities of neural interfaces36,37. As shown in Fig. 4a and b, the impedance magnitude and phase at 1 kHz showed no significant changes after mETF for both gold and EIROF electrodes (gold: 32.3 ± 10.8 to 27.3 ± 14.1 kW, IrOx: 4.1 ± 0.5 to 3.7 ± 0.4 kW; see Supplementary Fig. S11a and b for EIS spectra). Figure 4c presents the cathodic charge storage capacities (CSCC), which also confirmed that mETF did not result in any significant degradation (gold: 0.24 ± 0.02 to 0.18 ± 0.02 mC/cm2, IrOx: 38.8 ± 8.2 to 35.1 ± 11.7 mC/cm2; see Supplementary Fig. S11c for CV curves).
The mechanical resilience of mETF protruding structures against compression was evaluated to assess the potential deformation of the mETF LCP structures under physiological or surgical conditions. As shown in Fig. 4d, the mETF MEA with a height of 80 mm were subjected to increasing compression using a motorized force meter. The magnified plot in Fig. 4e suggests that the 3D electrodes are compressed by no greater than 2.2 mm under the normal range of pressures experienced in physiological conditions, including (i) intraocular pressure (1.3–2.8 kPa38) and (ii) intracranial pressure (0.9–2 kPa39), as described in Fig. 4f. Even after the mETF MEA was completely flattened under a load pressure of 150 kPa, the original height and mechanical properties were recovered after the force is released, as demonstrated by the three cycles of full compression and relaxation (Fig. 4d).
These results suggest that the proposed mETF with proper designs enables the reliable production of 3D structures without compromising the physical and electrochemical properties of neural interfaces.
Benefits of mETF MEA for subretinal stimulation in FEA study
The benefits of mETF MEA with protruding structures were evaluated for subretinal stimulation of blind patients through FEA in a human retinal model40,41. A subretinal electrode is implanted under the retina, facing toward the bipolar cells and retinal ganglion cells (RGCs) (see Supplementary Fig. S12 and Table S1 for retinal model). Given the distance between the electrode surface and targeted bipolar cells in the inner nuclear layer (INL), subretinal stimulation is expected to benefit from protruding 3D structures which would create more focused current distribution at the target cells. Improvement in neural interfaces enabled by 3D subretinal electrodes was quantified in terms of stimulation threshold (Ith), dynamic range (DR), and spatial resolution, as shown in Fig. 5.
The Ith and DR were evaluated based on the E-field distribution at INL generated by current injection from a 3×3 subretinal electrode array with varying protruding heights from 0 to 100 mm. The Ith is defined as the current intensity required to induce an electric field (E-field) exceeding 3,000 V/m at the plane of the INL to activate bipolar cells27,42,43. The DR is a current range from Ith to the maximum current (Imax), beyond which inter-channel interference occurs between adjacent electrodes. The representative E-field distributions at INL from planar and 80-mm-protruding MEA are presented with increasing stimulation currents from planar in Fig. 5a and b. Notably, the 80-mm-protruding electrodes lowered the Ith to 4.5 mA from 6 mA of the planar electrodes. Increasing current beyond the Imax began to induce inter-channel interference, at which the INL area activated by a channel (contoured by white dashed lines in Fig. 5b) overlapped with the area activated by adjacent channels. The onset of interferences defines the upper boundary of the stimulation DR, which was extended from 14.5 mA for the planar array to 18.9 mA for the 80-mm-protruding array. A similar analysis for varying protruding heights from 0 to 100 mm (see Supplementary Fig. S13) suggested that the higher protrusions resulted in lower Ith and wider DR, as plotted in Fig. 5c. Such enhancement of 3D electrodes can be explained by more focused current distribution at INL, as shown in Fig. 5d (I = Ith). The MEA with higher protrusion generated higher contrast in the E-field profiles between the targeted area and untargeted area. However, the 100-mm-protruding array induced an uneven E-field distribution, presumably due to an unmitigated edge effect from an excessively close electrode–cell distance. Therefore, we concluded that an 80 mm protrusion is the optimum height for efficient subretinal stimulation, which was adopted for the proof-of-concept 25-channel 3D array presented in the previous sections.
The protruding MEA is also predicted to enhance the spatial resolution of retinal stimulation, which was quantified using the Michelson contrast (MC), measuring the ratio of (Emax − Emin) to (Emax + Emin) (more details in the Methods), as shown in Fig. 5e. Higher protrusion of the electrodes led to a higher E-field contrast (Supplementary Fig. S14) and correspondingly higher MC values across the entire range of channel pitches from 250 to 600 mm.
Benefits of mETF MEA for subretinal stimulation in ex vivo experiments
The effectiveness of mETF MEA for enhanced neural interfaces in subretinal stimulation were evaluated through ex vivo retina experiments, by comparing the protruding mETF MEA and planar MEA in terms of stimulation threshold and spatial resolution. Activation of RGCs was monitored by imaging the calcium transients in response to electrical subretinal stimulation, using a custom-built fluorescence microscopy setup (Fig. 6a). As shown in Fig. 6b, the MEA placed under the mouse retina patch included both planar and 80-μm-mETF protruding electrodes with a diameter of 100 mm (Supplementary Fig. S6). A genetically-encoded calcium indicator, sRGECO, was introduced to the retina via adeno-associated viral (AAV) vectors and its expression in RGC layer was confirmed three weeks after the injection (Fig. 6c). A typical calcium transient, in response to biphasic current pulses, is represented by normalized changes in fluorescence, DF/F0 = (Fpeak – F0)/F0, as shown in Supplementary Fig. S15.
The stimulation threshold was evaluated by quantifying DF/F0 of RGCs placed within the diameter of stimulating electrode (Fig. 6d) while increasing the current injection. As shown in Fig. 6e, the resulting responses were fitted into sigmoidal functions, from which the threshold was defined as the stimulation current at the half of the maximum DF/F0. The protruding electrode significantly lowered the median stimulation threshold to 0.91 mA, compared to 1.55 mA of the planar electrode, as shown in Fig. 6f. This suggests that the closer proximity of protruding structure to bipolar cells and RGCs allowed for neural activation with a lower current.
The spatial extent of electrical activation was quantified by DF/F0 of RGCs depending on their distances from the center of stimulating electrode (Fig. 6d) at a fixed current of I = 20 mA, as shown in Fig. 6g. The response curves were fitted by Gaussian functions to determine the spatial extents, defined as the half-width at half maximum (HWHM) of DF/F0. The protruding electrode produced more focused retinal activation by reducing the HWHM from 94.8 to 43.7 mm, which well agrees with the FEA estimation in Fig. 5d. Stimulation with I = 10 mA resulted in consistent outcome (99.7 to 39.2 mm), as shown in Supplementary Fig. S16. The HWHM of the protruding electrode comparable to its radius (50 mm) indicates that the mETF MEA activates the retina with high contrast and minimized inter-channel interference, potentially providing artificial vision with higher spatial resolution.
Previous reports have indicated that retinal cells gradually migrate into the voids around the pillars of protruding electrodes after six weeks of in vivo implantation2,44. Such migration reduces the separation between the electrodes and target cells with preserved axonal network27, suggesting the benefits of 3D mETF MEA may also be applicable to in an in vivo retinal environment.