The setup used for ML MoS2 growth (on SiO2/Si substrates) is shown in Fig. 1a. The reactor is a quartz tube (60 mm diameter). Three heated zones provide independent control over evaporation temperature of the precursors and growth temperature at the substrate, with the zones separated by 75 mm wide insulation barriers. Inert carrier gas (Ar or N2) transports the vaporized precursors to the substrate kept downstream. We also introduce a small amount of oxygen (O2) into the system (see Methods for details of the growth process), as it is shown to improve the growth37. Before heating, the reactor is flushed with high-purity inert gas to obtain reduced levels of residual moisture and O2 (see Supporting Information section I and Video V1 for corresponding simulations of the tube environment). Figure 1b shows a model of the reactor, as used for the simulations with appropriate boundary conditions and sources. Chalcogen (sulfur) powder and transition metal oxide (MoO3) powders are placed in alumina boats in the first and second heating zones respectively.
To ensure maximum precursor impingement on the growing surface, the substrate is placed vertically in the third heating zone. As we will see later, vertical placement also enables minimum spatial variation in the precursor concentration, providing a more uniform growth environment. In contrast, for a horizontally kept substrate, even for small dimensions (1 × 1 cm2), a concentration gradient is expected32,33 (also see Supporting Information section II). This gradient is most pronounced during the nucleation stage, and critically affects the type of growth obtained. To support the substrate in a vertical configuration, we created a slot (a groove, 1 mm deep, 1–2 mm wide) in the bottom supporting alumina plate, and supported at the back by an alumina boat (see Fig. 1b, lower left).
Remarkably, presence of the slot is decisive toward obtaining ML MoS2 growth at similar growth conditions across different growth runs and substrates. Figure 1c and 1d are optical microscopy images of 300 nm SiO2/Si substrates after CVD growth, when the substrate is placed inside the slot, and without the slot, respectively. A Raman peak shift of ~ 20 cm− 1, and typical optical contrast confirms the presence of ML MoS238 (see Supporting Information section III for optical spectroscopy and SEM characterization). The presence of ML MoS2 flakes only in the case of the slotted configuration is striking, and points toward the significant effect of the slot on modifying local growth environment.
Development of the multiphysics digital-twin. We used COMSOL Multiphysics© to develop a coupled gas-flow, precursor concentration, and temperature distribution 3D model for a realistic simulation of the CVD process. To understand the gas flow dynamics and the precursor concentration inside the slot, we carefully modeled the source geometry, substrate supports, and specific materials of various assemblies. The synthesis process can be divided into four broad parts – nitrogen flushing, reactor heating, precursor vaporization, and reaction and deposition. We developed an integrated model for the first three of the mentioned processes, simulating the actual experimental conditions as closely as possible (see Methods for mesh sizes for simulations and specific COMSOL modules used). The deposition process is modeled considering evaporation and downstream transport of powder precursors to the substrate.
In the context of CVD, transfer of physical quantities inside a physical system is a combination of convection (due to inert carrier gas flow) and diffusion25,26 (due to concentration gradients). The governing equation for describing such a physical phenomenon is the diffusion-convection equation (DCE):
$$\:\begin{array}{c}\frac{\partial\:C\left(x,y,z,t\right)}{\partial\:t}=\:\overrightarrow{\nabla\:}.\left(D\overrightarrow{\nabla\:}C\left(x,y,z,t\right)-\overrightarrow{v}C\left(x,y,z,t\right)\right)\#\left(1\right)\end{array}$$
where C is the local fluid concentration (mol/m3), \(\:\overrightarrow{v}\) is the carrier gas velocity (m/s), D is the precursor diffusivity in the carrier gas (m2/s)39, and x (m) is the coordinate along the reactor. Using the DCE, we can also model precursor evaporation with the addition of a source term:
$$\:\begin{array}{c}\frac{\partial\:C\left(x,y,z,t\right)}{\partial\:t}=\:\overrightarrow{\nabla\:}.\left(D\overrightarrow{\nabla\:}C\left(x,y,z,t\right)-\overrightarrow{v}C\left(x,y,z,t\right)\right)\:+\:{r}_{v}\left(x,y,z,t\right)\#\left(2\right)\end{array}$$
where rv is the precursor source term, i.e., molar production rate per unit volume (mol/(m3.s)). The saturation vapor pressure (Ps) for a given species is primarily a function of temperature (T)40,41. We used the Knudsen-Langmuir Eq. 42 to model the temperature dependent evaporation of the precursors, as detailed in Supporting Information section IV.
Understanding concentration profiles and fluid flow inside the reactor. We first examine precursor and O2 spatiotemporal profiles at the substrate. We note that our synthesis process minimizes precursor evaporation prior to the set temperature being realized (see Supporting Information section IV for corresponding axial simulations of MoO3 and O2). Hence, for the purpose of modeling precursor evaporation, we allow the precursors to evaporate only after heating is completed (30 mins).
Figure 2 shows the MoO3/S8 ratio and O2 profiles at the substrate after 5 minutes of the beginning of growth, with and without the slot. Elemental sulfur (S) in its vaporized form exists as S8 (octa-sulfur) molecules43. Hence, the concentrations of sulfur and oxygen depicted are those of S8 and O2 species respectively, and are discussed as such in the rest of the paper. Elemental concentrations may be obtained by multiplying S8 and O2 concentrations by a factor of 8 and 2 respectively. Importantly, the presence of the slot does not result in a spatially varying precursor profile at the substrate for any of the simulated species, and thus we have indicated the average values of precursor concentration. Nor does it affect the average surface concentration of the reacting species compared with the non-slotted configuration (MoO3/S8 ratio (Fig. 2a, 2c), O2 (Fig. 2b, 2d)). A similar trend was observed throughout the growth time (see Supporting Information section IV and Videos V2, V3, and V4 for simulated profiles along the length of the reactor and at other time steps during growth).
Precursor concentration gradients are not the underlying reason for the observed drastic changes in growth between slotted and non-slotted configurations. Concentration, velocity fields, and temperature are the primary parameters affecting nucleation and growth, amongst which concentration and temperature are similar for both slotted and non-slotted configurations. Hence, we must take a careful look at the velocity profiles near the substrate.
First, we calculate the Reynolds and Mach numbers to understand the type of carrier gas flow (laminar vs. turbulent, and incompressible vs. compressible, respectively) in our reactor. The Reynolds number (\(\:Re\)) is a nondimensional number that quantifies the ratio of inertial to viscous forces in a flow field, calculated as
$$\:\begin{array}{c}Re=\:\frac{\rho\:uL}{\mu\:}\#\left(3\right)\end{array}$$
where \(\:\rho\:\) is carrier gas density (kg/m3), \(\:u\) is carrier gas speed (m/s), \(\:L\) is characteristic length (m) (the diameter of the tube here), and \(\:\mu\:\) is carrier gas dynamic viscosity (kg/(m.s)). A lower value of Re (typically < 103) predicts the flow to be laminar44,45. Further, the Mach number is defined as
$$\:\begin{array}{c}M=\:\frac{u}{c}\#\left(4\right)\end{array}$$
where \(\:u\) is carrier gas flow speed (m/s) and \(\:c\) is speed of sound in the inert carrier gas (m/s). Typical gas flow speeds in our CVD reactor are of the order of 10− 2-10− 3 m/s, and with ambient viscosity. The above equations lead to Re ~ 10 and Mach number ~ 10− 4-10− 5 and thus, the carrier gas flow should be laminar and incompressible. Although the calculated Mach number is low, we have employed the compressible fluid flow sub-module, because large temperature variations in the system (as revealed by our multiphysics simulations) can cause significant density changes inside the CVD reactor.
Now, we simulate the carrier gas velocity streamlines (while accounting for simulated temperature profiles), representative of the fluid flow direction at any given point. In any given volume element, the evaporated precursor atoms will be imparted momentum in the direction tangential to its nearby streamlines. Hence, streamlines serve as useful tools for visualizing and understanding the local growth environment near the substrate. For discussion, we have indicated (Fig. 3) only those set of streamlines that impinge on the surface of the substrate, and ignored the ones which fall outside or go around.
A comparison between Fig. 3a (slotted) and Fig. 3b (non-slotted) reveals that the carrier gas, upon encountering the substrate, is pushed down toward the slot, whereby its velocity decreases due to the slot geometry. Thus, a region of very low velocity, hereafter referred to as a “velocity dead-zone” (stationary zone) is created near the slot. Due to the lower flow velocity and laminar nature of fluid flow, streamlines bend inside the slot (Fig. 3d). For the non-slotted configuration (Fig. 3c), streamlines show a reversal of the flow at bottom of the substrate, leading the flow away from the surface before turning sideways to continue the forward flow. This reverse current is suppressed in Fig. 3d due to the slot geometry confining the flow inside it. This can directly affect the nucleation density at the substrate, as we will see later.
Next, we examined the velocity profiles directly at the substrate surface. Note that during heating and growth, the velocity inside the reactor is in a steady-state, and hence we plot the steady-state magnitudes of the velocity components. Figure 4a and 4d show the transverse velocity profiles over the substrate, distinctly showing an overall reduction in magnitude in the case when a slot is present. This effect is more pronounced in the region of the substrate physically inside the slot, where the velocity is almost two orders of magnitude lower than in the nearby region (physically outside the slot). Figure 4b and 4e show surface plots of the normal component of the velocity at the substrate. It can be seen in Fig. 4b that a lower velocity region exists toward the bottom of the substrate where it is in contact with the alumina plate. With the slotted configuration in Fig. 4e, this area extends out. The significant changes in the local growth environment due to modified gas flow dynamics should directly affect the delivery of precursor on the substrate.
To corroborate our understanding of the non-trivial influence of the carrier gas velocity profile and precursor concentration, we calculated the incoming precursor flux (\(\:J\), at the substrate) analytically. The steady-state nucleation rate46 goes as \(\:{Q}_{0}\propto\:\:{J}^{2}\) (see Supporting Information section V for a detailed derivation). Hence, a decreased precursor flux to the substrate would result in an overall reduction in the nucleation density.
Using data obtained from the multiphysics simulations, particularly precursor concentration, surface temperature during the estimated nucleation window (roughly between 1–5 minutes of growth, see Supporting Information section IV), and the velocity components at the substrate, we obtained the precursor flux at each substrate surface element (governed by the mesh size employed for simulations). Earlier studies have indicated that TMD nucleation is governed primarily by the concentration and adsorption-desorption equilibrium of the transition metal precursor15,47,48. With this in mind, Fig. 4c and 4f show the calculated MoO3 flux, incoming at the substrate at 5 minutes of growth, for the non-slotted and slotted configurations, respectively (see Supporting Information section V for MoO3 flux profiles throughout the growth, S flux profiles, and details of the flux calculations). In the presence of a slot, the MoO3 flux reduces to 1/3rd of the value compared to the case without slot. Interestingly, the spatial variation in the precursor flux and the surface velocity follows a similar trend.
To directly measure the nucleation density, we performed scanning electron microscopy (SEM) of the substrates. Figure 4g, 4h and 4i, 4j correspond to slotted and non-slotted configurations, respectively, under similar optimized growth conditions (see Supporting Information section VI for comparison at other vertical distances from the slot). A comparison of Figs. 4g and 4i, which are taken at similar vertical positions on the substrate, well away from the slot, shows similar density, size and shape of nucleation sites. A more careful observation reveals the presence of small MoS2 flakes with a triangular shape. Due to an increased rate of nucleation in this region, the growth of MoS2 flakes is limited to a maximum edge length of ~ 1–2 µm. On the contrary, Figs. 4h (in the slot) and 4j (without slot), which are at the same vertical positions on the substrate, show remarkably different depositions. In Fig. 4h, the nucleation density is reduced, and MoS2 triangular flakes with edge length \(\:\ge\:\:\)30 µm are observed. Interestingly, for the substrate kept without a slot (Fig. 4j), a deposition similar to Fig. 4g and 4i is observed. This is direct evidence that a slot-induced, confined space reaction environment leads to a decrease in the nucleation density. Hence, reduced precursor flux leads to reduced nucleation density in the slot. Thus, precursor flux, and not just the precursor concentration, is the decisive parameter controlling nucleation.
Predicting temperature variations in the CVD reactor. Temperature has a significant impact on nucleation and ML growth. Even in analytical calculations for the impingement rates discussed above, the rate of nucleation depends exponentially on the temperature of the substrate. Thus, a complete understanding of the dynamic heating process and local temperatures in a CVD reactor is necessary. In our COMSOL model, we accounted for the heating rate and heat diffusion between neighboring heating zones, as well as realistic thermal conductivity of materials in the reactor (alumina, quartz, and inert gas). Such a model is valuable even for simulating the post-deposition cooling process, with an effect on uncontrolled deposition.
Figure 5 and Video V5 depict the time-dependent simulated axial temperature profile along the reactor. The set temperatures of all three zones are achieved in 30 minutes (onset of the growth time in our CVD process). We observe that there is finite heat leakage via the insulation zones, and the temperatures of the areas near to the insulation zone are less than at the centers of the heating zones. Further, due to the presence of heating sources at the radial boundaries, a radial temperature gradient forms in the reactor (see Supporting Information section VII).
Remarkably, the temperature (Fig. 5c) of the substrate assembly (combination of substrate, alumina boat, and plate) is much lower than the center of the heating zone. As a critical experimental insight, we observe that by the onset of growth, the substrate is still not at the desired temperature, and doesn’t reach the set temperature even till the growth is finished (Fig. 5e and Supporting Information section VII). We note that such an observation is very challenging to be made experimentally and leads to a more comprehensive understanding of the observed growth. Through careful selection of holder materials and adjustment of the growth process, such effects may be minimized, or even tuned.
We attribute this significant time-lag to the large heat capacity of the substrate assembly, compared to the inert environment. The specific heat capacities of inert gas (N2) and alumina are similar. However, the large difference in density leads to a larger heat capacity for alumina boats and supports, compared to that of the surrounding inert atmosphere (see Supporting Information section VII). Figure 5e shows time-dependent plots for the heat source and the average surface temperature at the substrate, with and without alumina supports. The average temperature at the substrate significantly lags behind the source due to the alumina supports, while it follows the source temperature closely in the absence of alumina (with air being replaced for alumina in the simulations) as supporting material. We note that “without alumina supports” is a hypothetical setting used in the simulation, where the substrate is unsupported. In reality, such a system can be created by using a holder with one or a few contact points on the substrate.
The large temperature differences between the substrate and environment have profound effects on the growth process, especially on the nucleation happening at the initial stage of growth. Similarly, such temperature variation could also be found in the precursor alumina boats, which implies that the actual temperature of precursor evaporation may be much lower than expected. Also, large temperature gradients might lead to deposition of unreacted material, and bulk/secondary deposition resulting in poor quality of growth. In short, low temperature differentials are expected to lead to controllable film growth, and conversely, high temperature differentials can lead to particle formation but higher growth rates. The significant temperature differentials between the substrate and local inert gas environment may also give rise to thermo-diffusion or the Ludwig-Soret effect49,50, which can lead to the aggregation of heavier (MoO3) and lighter (S) precursors in the colder and warmer regions of the as-formed thermal boundary layer close to the substrate51,52.